TY  - JOUR
A1  - Chiang, H 
A1  - Chung, C 
A1  - Chen, L 
A1  - Li, Y 
A1  - Wong, C P
A1  - Fu, S 
T1  - Processing and shape effects on silver paste electrically conductive adhesives (ECAs).
Y1  - 2005//
N1  - R831489
JF  - JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY
J1  - J ADHES SCI TECHNOL
VL  - 19
IS  - 7
SP  - 565
EP  - 578
ER  - 


TY  - JOUR
A1  - Dong, H 
A1  - Zhang, Z 
A1  - Wong, C P
T1  - Molecular dynamics study of a nano-particle joint for potential lead-free anisotropic conductive adhesives applications.
Y1  - 2005/01/1
N1  - R831489
JF  - JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY
J1  - J ADHES SCI TECHNOL
VL  - 19
IS  - 2
SP  - 87
EP  - 94
ER  - 


TY  - JOUR
A1  - Dong, H 
A1  - Moon, K 
A1  - Wong, C P
T1  - Molecular dynamics study of nanosilver particles for low-temperature lead-free interconnect applications.
Y1  - 2005//
N1  - R831489
JF  - JOURNAL OF ELECTRONIC MATERIALS
J1  - J ELECTRON MATER
VL  - 34
IS  - 1
SP  - 40
EP  - 45
ER  - 


TY  - JOUR
A1  - Jiang, H J
A1  - Moon, K 
A1  - Zhang, Z Q
A1  - Pothukuchi, S 
A1  - Wong, C P
T1  - Variable frequency microwave synthesis of silver nanoparticles.
Y1  - 2006//
N1  - R831489
JF  - JOURNAL OF NANOPARTICLE RESEARCH
VL  - 8
IS  - 1
SP  - 117
EP  - 124
ER  - 


TY  - JOUR
A1  - Jiang, H 
A1  - Moon, K 
A1  - Lu, J 
A1  - Wong, C P
T1  - Conductivity enhancement of nano silver-filled conductive adhesives by particle surface functionalization.
Y1  - 2005/11/
N1  - R831489
JF  - JOURNAL OF ELECTRONIC MATERIALS
J1  - J ELECTRON MATER
VL  - 34
IS  - 11
SP  - 1432
EP  - 1439
ER  - 


TY  - JOUR
A1  - Li, Y 
A1  - Xiao, F 
A1  - Moon, K 
A1  - Wong, C P
T1  - Novel curing agent for lead-free electronics: amino acid.
Y1  - 2005/01/15
N1  - R831489
JF  - JOURNAL OF POLYMER SCIENCE PART A-POLYMER CHEMISTRY
J1  - J POLYM SCI POL CHEM
VL  - 44
IS  - 2
SP  - 1020
EP  - 1027
ER  - 


TY  - JOUR
A1  - Li, Y 
A1  - Moon, K 
A1  - Wong, C P
T1  - Materials science. Electronics without lead.
Y1  - 2005/06/
N1  - R831489
JF  - SCIENCE
J1  - SCIENCE
VL  - 308
IS  - 5727
SP  - 1419
EP  - 1420
ER  - 


TY  - JOUR
A1  - Li, Y 
A1  - Moon, K 
A1  - Wong, C P
T1  - Adherence of self-assembled monolayers on gold and their effects for high-performance anisotropic conductive adhesives.
Y1  - 2005/03/
N1  - R831489
JF  - JOURNAL OF ELECTRONIC MATERIALS
J1  - J ELECTRON MATER
VL  - 34
IS  - 3
SP  - 266
EP  - 271
ER  - 


TY  - JOUR
A1  - Li, Y 
A1  - Moon, K 
A1  - Wong, C P
T1  - Monolayer-protected silver nano-particle-based anisotropic conductive adhesives: electrical and thermal properties.
Y1  - 2005//
N1  - R831489
JF  - JOURNAL OF ELECTRONIC MATERIALS
J1  - J ELECTRON MATER
VL  - 34
IS  - 12
SP  - 1573
EP  - 1578
ER  - 


TY  - JOUR
A1  - Li, Y 
A1  - Moon, K 
A1  - Wong, C P
T1  - Reliability improvement of conductive adhesives on tin (Sn) surfaces.
Y1  - 2005//
N1  - R831489
JF  - JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY
J1  - J ADHES SCI TECHNOL
VL  - 19
IS  - 16
SP  - 1427
EP  - 1444
ER  - 


TY  - JOUR
A1  - Li, Y 
A1  - Moon, K 
A1  - Wong, C P
T1  - Enhancement of electrical properties of anisotropically conductive adhesive joints via low temperature sintering.
Y1  - 2006/02/
N1  - R831489
JF  - JOURNAL OF APPLIED POLYMER SCIENCE
J1  - J APPL POLYM SCI
VL  - 99
IS  - 4
SP  - 1665
EP  - 1673
ER  - 


TY  - JOUR
A1  - Li, Y 
A1  - Wong, C P
T1  - Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: materials, processing, reliability and applications.
Y1  - 2006/01/30
N1  - R831489
JF  - MATERIALS SCIENCE AND ENGINEERING: R: REPORTS
J1  - NONE
VL  - 51
IS  - 1-3
SP  - 1
EP  - 35
ER  - 


TY  - JOUR
A1  - Li, Y 
A1  - Moon, K 
A1  - Wong, C P
T1  - Electrical property improvement of electrically conductive adhesives through <em>in-situ</em> replacement by short-chain difunctional acids.
Y1  - 2006/03/
N1  - R831489
JF  - IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES
J1  - IEEE T COMPON PACK T
VL  - 29
IS  - 1
SP  - 173
EP  - 178
ER  - 


TY  - JOUR
A1  - Moon, K 
A1  - Li, Y 
A1  - Xu, J W
A1  - Wong, C P
T1  - Lead-free interconnect technique by using variable frequency microwave.
Y1  - 2005//
N1  - R831489
JF  - JOURNAL OF ELECTRONIC MATERIALS
J1  - J ELECTRON MATER
VL  - 34
IS  - 7
SP  - 1081
EP  - 1088
ER  - 


TY  - JOUR
A1  - Moon, K 
A1  - Dong, H 
A1  - Maric, R 
A1  - Pothukuchi, S 
A1  - Hunt, A 
A1  - Li, Y 
A1  - Wong, C P
T1  - Thermal behavior of silver nanoparticles for low-temperature interconnect applications.
Y1  - 2005//
N1  - R831489
JF  - JOURNAL OF ELECTRONIC MATERIALS
J1  - J ELECTRON MATER
VL  - 34
IS  - 2
SP  - 168
EP  - 175
ER  -